Yesterday, a reliable leaker disclosed the key specs of the forthcoming Oppo Reno 8 Pro smartphone. While we already reported most of its specs in a post a few days earlier, this new leak provides us with a deeper look at the device.
The Leaker, who goes by the name Digital Chat Station, revealed the details of the device on Weibo, a Chinese social networking website. According to him, the Pro variant of the Oppo Reno 8 will feature a MediaTek Dimensity 8100 Max chip. And As we reported in a story preceding this, the device will be paired with the OPPO's very own MariSilicon X imagining NPU.
The Reno 8 Pro Features a punch-hole design, fitted with a 32MP Sony IMX709 front snapper on the front. The upcoming handset packs a 6.7-inch Full HD+ display made by BOE.
The back panel, on the contrary, will include a triple camera system with a 50-megapixel Sony IMX766 main sensor. The Reno 8 Pro smartphone will be backed by a 4,500mAh battery pack with support for 80W rapid charging.
An X-axis linear motor, twin stereo speakers, NFC, and an aviation-grade aluminum alloy frame were among the additional specs of the new Reno OPPO mobile shared by the tipster.
According to the source, the Reno 8 Pro weighs roughly 183gm and is 7.34mm thick. He also mentioned that there would be at least three color options: grey, green, and black. Other than that, the standard Reno 8 coming with the Snapdragon 7 Gen 1 will also have the MariSilicon X imaging NPU, the tipster added.
